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Journals

2024

83. Soyeon Lim, Deok-Hye Park, Hyewon Jin, Jaeyeon Park, Yeosol Yoon, Soo-Kil Kim, Kyung-Won Park*, and Taeho Lim*, "Boosting hydrogen evolution reaction in acidic and neutral conditions on electrodeposited CuCoMo electrocatalyst: catalytic activity enhancement through electrochemical oxidation", Under review.

82. Soyeon Lim and Taeho Lim*, "A study on effect of electrodeposited CoSe electrocatalyst dissolution on hydrogen evolution reaction in acidic environments", Under review.

81. Yeosol Yoon, Soyeon Lim, and Taeho Lim*, 

2023

80. Bobae Ju, Hee Jo Song, Hyunseok Yoon, Do Kyung Kim, Hye Won Jin, Taeho Lim*, and Dong-Wan Kim*, "Understanding the Metal Carbonyl-Assisted Synthesis of PtMoCu/C Nanocatalysts for Proton-Exchange Membrane Fuel Cells", ACS Sustainable Chem. Eng. 11 (2023) 16108.

79. Jihyeok Song, Youngkwang Kim, Jongmin Lee, Hyun-Jong Kim, Yung-Eun Sung, Taeho Lim*, and Oh Joong Kwon*, "Implementation of proton exchange membrane water electrolyzer with ultralow Pt loading cathode through Pt particle size control", ACS Sustainable Chem. Eng. 11 (2023) 16258.

78. Hyeonsu Kim, Jiseok Lee, Taeho Lim*, and Jae Jeong Kim*, "Transformation of SiO2 Particles to Si Film via Al-assisted Electrochemical Reduction in Molten CaCl2", ECS J. Solid State Sci. Technol. 12 (2023) 124004.

77. Taeho Lim* and Yeosol Yoon, "Pulse Electrodeposition of Polycrystalline Si Film in Molten CaCl2 Containing SiO2 Nanoparticles", J. Electrochem. Sci. Technol. 14 (2023) 326.

76. Jaeseong Park, Daegeun Kim, Chan-Sei Yoo, Taeho Lim*, and Bo-mook Chung*, "Development of Cost‑Effective Ni‑Less Surface Finishing Process for High‑Speed PCBs", J. Electron. Mater. 52 (2023) 7504.

75. Kyong Kyu Myong, Jinuk Byun, Jiseok Lee, Taeho Lim*, and Jae Jeong Kim*, "Development of a pH-independent Post-CMP Cleaning Solution using Phosphoric Acid-based Surfactants for Removal of Ceria Nanoparticles", ECS J. Solid State Sci. Technol. 12 (2023) 074004.

74. Yeosol Yoon, Sehyun Yoo, and Taeho Lim*, "Electrodeposition of Ni-Co-S Electrocatalyst Using 2,5-dimercapto-1,3,4-thiadiazole as S Precursor for Hydrogen Evolution Reaction at Neutral pH", Electrocatalysis  14 (2023) 800.

2022

73. Youngkwang Kim, Hyo Eun Bae, Dohyeon Lee, Jeongwoo Kim, Eunjik Lee, Songi Oh, Ji-Hoon Jang, Yong-Hun Cho, Mohanraju Karuppannan, Yung-Eun Sung, Taeho Lim*, and Soo-Kil Kim*, "High-performance long-term driving proton exchange membrane fuel cell  implemented with chemically ordered Pt-based alloy catalyst at ultra-low Pt loading", J. Power Sources  533 (2022) 231378.

72. Soyeon Lim and Taeho Lim*, "Pulse electrodeposition of NiCoS on carbon paper for electrochemical hydrogen evolution reaction", Ceramist  25 (2022) 194.

71. Taeho Lim* and Soo-Kil Kim*, "Non-precious Hydrogen Evolution Reaction Catalysts: Stepping Forward to Practical Polymer Electrolyte Membrane-based Zero-gap Water Electrolyzers", Chem. Eng. J.  433 (2022) 133681.

2021

70. Sehyun Yoo, Youngkwang Kim, Yeosol Yoon, Mohanraju Karuppannan, Oh Joong Kwon*, and Taeho Lim*, "Encapsulation of Pt Nanocatlayst with N-containing Carbon Layer for Improving Catalytic Activity and Stability in the Hydrogen Evolution Reaction",  Int. J.  Hydrog. Energy  16 (2021) 21454.

69. Jinuk Byun, KiHo Bae, Ohsung Kwon, Kyong Kyu Myung, Taeho Lim*, and Jae Jeong Kim*, "Effect of Complexing Agents on Surface Composition for Co Post-CMP Cleaning Process",  ECS J. Solid State Sci. Technol. 10 (2021) 024011.

68. Minjae Sung, Yoonjae Lee, Myunghyun Lee, Youngkeun Jeon, Taeho Lim*, Young Gyu Kim*, and Jae Jeong Kim*, "Polyethylene Glycol-Based Single Organic Additive for Through Silicon Via Filling and its Structural Modification Effect",  J. Electrochem. Soc.  168 (2021) 01256.

67. Xiangyun Xiao, Euiyoung Jung, Sehyun Yu, Hyeonjin Kim, Hong-Kyu Kim, Kwan-Young Lee, Jae-Pyoung Ahn*, Taeho Lim*, Jinheung Kim*, and Taekyung Yu*, "Facile Aqueous-Phase Synthesis of Pd-FePt Core-Shell Nanoparticles for Methanol Oxidation Reaction",  Catalysts  11 (2021) 130.

66. Sung Ki Cho* and Taeho Lim, "Catalyst-Mediated Doping in Electrochemical Growth of Solar Silicon",  Electrochim. Acta  367 (2021) 137472.

65. Kyong Kyu Myong, Jinuk Byun, Min-ju Choo, Hojoong Kim, Jun Yong Kim,  Taeho Lim*, and Jae Jeong Kim, "Direct and Quantitative Study of Ceria-SiO2 Interaction Depending on Ce3+ Concentration for Chemical Mechanical Planarization (CMP) Cleaning",  Mater. Sci. Semicond. Process.  122 (2021) 105500.

2020

64. Xiangyun Xiao, Euiyoung Jung, Sehyun Yoo,  Taeho Lim,  Jinheung Kim, and Taekyung Yu*, "Controlling the Degree of Coverage of the Pt Shell in Pd@Pt Core-Shell Nanocubes for Methanol Oxidation Reaction",  Catalysts  10 (2020) 1133.

63. Dohyeon Lee, Sujin Gok, Youngkwang Kim, Yung-Eun Sung, Eunjik Lee, Jin-Hoon Jang, Jee Young Hwang, Oh Joong Kwon*, and Taeho Lim*, "Methanol Tolerant Pt-C Core-Shell Cathode Catalyst for Direct Methanol Fuel Cells",  ACS Appl. Mater. Interfaces  12 (2020) 44588-44596.

62. Han Ju Lee, Won-Chul Seo, and Taeho Lim*, "Electrochemical Reduction of SiO2 Granules to One-Dimensional Si Rods Using Ag-Si Eutectic Alloy",  J. Electrochem. Sci. Techol. 11 (2020) 392-398.

61. Ohsung Kwon, KiHo Bae, Jinuk Byun, Taeho Lim*, and Jae Jeong Kim*, "Study on Effect of Complexing Agents on Cu Oxidation/Dissolution for Chemical-Mechanical Polishing and Cleaning Process",  Microelectron. Eng. 227 (2020) 111308.

60. Hyeonsu Kim, Seungyeon Baek, Taeho Lim*, and Jae Jeong Kim*, "Electrochemical Reduction of Nitrous Oxide in 1-Butyl-3-Methylimidazolium Tetrafluoroborate Ionic Liquid Electrolyte",  Electrochem. Commun. 113 (2020) 106688.

59. Jeongsoo Hwang, Youngkwang Kim, Mohanraju Karuppnan, Taeho Lim*, and Oh Joong Kwon*, "Facile Synthesis of a Carbon-Encapsulated Pd Catalyst for Oxygen Reduction Reaction in Proton Exchange Membrane Fuel Cells",  Electrocatalysis 11 (2020) 77-85.

2019

58. Jin-Young Park, Hyun-suk Park, Sang-Beom Han, Da-Hee Kwak, Ji-Eun Won, Taeho Lim, and Kyung-Won Park*, "Organic Ligand-Free PtIr Alloy Nanostructures for Superior Oxygen Reduction and Evolution Reactions",  J. Ind. Eng. Chem. 77 (2019) 105-110.

57. Hyo Eun Bae, Yeong Don Park, Tae-Hyun Kim, Taeho Lim, and Oh Joong Kwon*, "Carbon-Caged Palladium Catalysts Supported on Carbon Nanofibers for Proton Exchange Membrane Fuel Cells",  J. Ind. Eng. Chem. 79 (2019) 431-436.

56. Mohanraju Karuppannan, Youngkwang Kim, Sujin Gok, Eunjik Lee, Jee Youn Hwang, Ji-Hoon Jang, Yong-Hun Cho, Taeho Lim*, Yung-Eun Sung*, and Oh Joong Kwon*, "A Highly Durable Carbon-Nanofiber-Supported Pt-C Core-Shell Cathode Catalyst for Ultra-Low Pt Loading Proton Exchange Membrane Fuel Cells: Facile Carbon Encapsulation",  Energy Environ. Sci. 12 (2019) 2820-2829.

55. Minjae Sung, Anna Lee, Taeyoung Kim, Young Yoon, Taeho Lim*, and Jae Jeong Kim*, "Sulfur-Containing Additives for Mitigating Cu Protrusion in Through Silicon Via (TSV)",  J. Electrochem. Soc. 166 (2019) D514-D520.

54. MinJae Sung, Sang-Hyeok Kim, Hyo-Jong Lee, Taeho Lim*, and Jae Jeong Kim*, "Working Mechanism of Iodide Ions and its Application to Cu Microstructure Control in Through Silicon Via Filling",  Electrochim. Acta 295 (2019) 224-229.

2018

 

53. Taeho Lim* and Jae Jeong Kim*, "Effect of B and W contents on Hardness of Electroless Co Alloy Thin Films",  Korean Chem. Eng. Res. 56 (2018) 895-900.

52. Dohyeon Lee, Taeho Lim, Hana Lim, Hyun-Jong Kim*, and Oh Joong Kwon*, "Copper Electrodeposition on Polyimide Substrate Using Polyaniline Film as a Seed Layer for Metallization of Flexible Devices",  Int. J. Electrochem. Sci. 13 (2018) 11829-11838.

51. Hyenki Kim, Hyunju Lee, Taeho Lim, and Sang Hyun Ahn*, "Facile Fabrication of Porous Sn-based Catalysts for Electrochemical CO2 Reduction to HCOOH and Syngas",  J. Ind. Eng. Chem. In press

 

50. Yu Seok Ham, Myung Jun Kim, Taeho Lim, Dong-Kwon Kim, Soo-Kil Kim*, and Jae Jeong Kim*, "Direct Formation of Dendritic Ag Catalyst on a Gas Diffusion Layer for Electrochemical CO2 Reduction to CO to H2", Int. J. Hydrogen Energ. 43 (2018) 11315-11325.

 

49. Youngkwang Kim, Mohanraju Karuppannan, Yung-Eun Sung, Taeho Lim*, and Oh Joong Kwon*, "Direct Formation of Pt Catalyst on Gas Diffusion Layer Using Sonochemical Deposition Method for the Application in Polymer Electrolyte Membrane Fuel Cell", Int. J. Hydrogen Energ. 43 (2018) 10431-10439.

 

48. Huizi Shen, Heo Chul Kim, Minjae Sung, Taeho Lim*, and Jae Jeong Kim*, "Thermodynamic Aspects of Bis(3-sulfopropyl) Disulfide and 3-Mercapto-1-propanesulfonic Acid in Cu Electrodeposition", J. Electroanal. Chem. 816 (2018) 132-137.  

 

2017

 

47. Youn Ji Min, Kwang Hwan Kim, Taeho Lim*, and Jae Jeong Kim*, "Investigation of Working Mechanism of Bis-(3-sulfopropyl) Disulfide (SPS) during Cu Electroless Deposition Using Real-Time Observation Method", J. Electrochem. Soc. 164 (2017) D1028-D1033.

 

46. Xingli Zou, Li Ji, Xiao Yang, Taeho Lim, Edward T. Yu and Allen J. Bard, "Electrochemical Formation of a p-n Junction on Thin Film Silicon Deposited in Molten Salt", J. Am. Chem. Soc. 139 (2017) 16060-16063.  

 

45. Minjae Sung, Hoe Chul Kim, Taeho Lim*, and Jae Jeong Kim*, "Effects of Organic Additives on Grain Growth in Electrodeposited Cu Thin Film During Self-Annealing", J. Electrochem. Soc. 164 (2017) D805-D809.

 

44. Xiao Yang, Li Ji, Xingli Zou, Taeho Lim, Ji Zhao, Edward T. Yu, and Allen J. Bard, "Toward Cost-Effective Manufacturing of Silicon Solar Cells: Electrodeposition of High-Quality Si Films in a CaCl2-based Molten Salt", Angew. Chem. Int. Ed. 56 (2017) 15078-15082.

 

43. Sujin Gok, Youngkwang Kim, Taeho Lim, Hyun-Jong Kim, and Oh Joong Kwon, "Performance of Pd Cathode Catalyst Electrodeposited on Gas Diffusion Layer in Polymer Electrolyte Membrane Fuel Cells", Electrocatalysis US, Accepted. 

 

42. Youngkwang Kim, Hyunjoon Lee, Taeho Lim, Hyun-Jong Kim, and Oh Joong Kwon, "Non-conventional Pt-Cu Alloy/Carbon Paper Electrochemical Catalyst Formed by Electrodeposition Using Hydrogen Bubble as Template", J. Power Sources 364 (2017) 16-22.

 

41. Eunkyoung Hwang, Hoyoung Kim, Hyanjoo Park, Taeho Lim, Yong-Tae Kim, Sang Hyun Ahn, and Soo-Kil Kim, "Pd-Sn Alloy Electrocatalysts for Interconversion Between Carbon Dioxide and Formate/Formic Acid", J. Nanosci. Nanotechnol. 17 (2017)  7547-7555.

 

40. Hyunjoon Lee, Yung-Eun Sung, Insoo Choi, Taeho Lim*, and Oh Joong Kwon*, "Novel Synthesis of Highly Durable and Active Pt Catalyst Encapsulated  in Nitrogen Containing Carbon for Polymer Electrolyte Membrane Fuel Cell", J. Power Sources 362 (2017) 228-235. 

 

39. Hyunjoon Lee, Min Jeong Kim, Taeho Lim, Yung-Eun Sung, Hyun-Jong Kim, Ho-Nyun Lee, Oh Joong Kwon, and Yong-Hun Cho, "A Facile Synthetic Strategy for Iron, Aniline-based Non-precious Metal Catalysts for Polymer Electrolyte Membrane Fuel Cells", Scientific reports 7:5396 (2017).

 

38. Yu Seok Ham, Seunghoe Choe, Myung Jun Kim, Taeho Lim, Soo-Kil Kim, and Jae Jeong Kim, "Electrodeposited Ag for the Electrochemical Reduction of CO2 to CO", Appl. Catal. B 208 (2017) 35-43.

 

37. Taeho Lim* and Jae Jeong Kim*, "Effect of Surface Pretreatment on Film Properties Deposited by Electro-/Electroless Deposition in Cu Interconnection", J. Korean Electrochem. Soc. 20 (2017) 1-6.

 

 

2016

 

36. Seunghoe Choe, Myung Jun Kim, Taeho Lim, Yu Seok Ham, Soo-Kil Kim, and Jae Jeong Kim, "Monitoring the Average Molecular Weight of Polyethylene Glycol in an Acidic Cu Plating Bath", J. Electrochem. Soc. 163 (2016) D747-D749.   

 

35. Yu Seok Ham, Myung Jun Kim, Jihui Choi, Seounghoe Choe, Taeho Lim, Soo-Kil Kim, and Jae Jeong Kim, "Fabrication of Ag Catalysts for Electrochemical Reduction of CO2 to Syngas", J. Nanosci. Nanotechnol. 16 (2016) 10846-10852. 

 

34. Ji Zhao, Huayi Yin, Taeho Lim, Hongwei Xie, Hsien-Yi Hsu, Fardad Forouzan, and Allen J. Bard, “Electrodeposition of Photoactive Silicon Films for Low-Cost Solar Cells”, J. Electrochem. Soc. 163 (2016) D506-D514.

 

33. Taeho Lim, Ok-Hee Kim, Yung-Eun Sung, Hyun-Jong Kim, Ho-Nyun Lee, Yong-Hun Cho, and Oh Joong Kwon, “Preparation of Onion-like Pt-terminated Pt-Cu Bimetallic Nano-sized Electrocatalysts for Oxygen Reduction Reaction in Fuel Cells”, J. Power Sources 316 (2016) 124-131.

 

32. Kwang Hwan Kim, Taeho Lim, Myung Jun Kim, Seunghoe Choe, Seungyeon Baek, and Jae Jeong Kim, “Porous Indium Electrode with Large Surface Area for Effective Electroreduction of N2O”, Electrochem. Commun. 62 (2016) 13-16.

 

2015

 

31. Kwang Hwan Kim, Taeho Lim, Kyung Ju Park, Hyo-Chol Koo, Myung Jun Kim, and Jae Jeong Kim, “Investigation of Cu Growth Phenomena on Ru Substrate During Electroless Deposition Using Hydrazine as a Reducing Agent”, Electrochim. Acta 151 (2015) 249-255.

 

2014

 

30. Kwang Hwan Kim, Taeho Lim, Myung Jun Kim, Seunghoe Choe, Kyung Ju Park, Sang Hyun Ahn, Oh Joong Kwon, and Jae Jeong Kim, “Direct Cu Electrodeposition on Electroless Deposited NiWP Barrier Layer on SiO2 Substrate for All-Wet Metallization Process”, J. Electrochem. Soc. 161 (2014) D756-D760.

 

29. Hoe Chul Kim, Myung Jun Kim, Seunghoe Choe, Taeho Lim, Kyung Ju Park, Kwang Hwan Kim, Sang Hyun Ahn, Soo-Kil Kim, and Jae Jeong Kim, “Electrodeposition of Cu Films with Low Resistivity and Improved Hardness Using Additive Derivatization”, J. Electrochem. Soc. 161 (2014) D749-D755.

 

28. Kyung Ju Park, Taeho Lim, Myung Jun Kim, Kwang Hwan Kim, Sun-Mi Hwang, and Jae Jeong Kim, “In-situ Transmittance Measurement for Characterization of Organic Additives in Cu Electroless Deposition”, J. Electroanal. Chem. 731 (2014) 157-162.

 

27. Taeho Lim, Kwang Hwan Kim, Kanghoon Kim, Hyunjoon Lee, Hyun-Jong Kim, Ho-Nyun Lee, Jae Jeong Kim, and Oh Joong Kwon, “Pd Seeding with the Sonochemical Method for Application of Cu Electroless Deposition to Cu Metallization”, J. Electrochem. Soc. 161 (2014) D453-D457.

 

26. Taeho Lim, Myung Jun Kim, Kyung Ju Park, Kwang Hwan Kim, Seunghoe Choe, Young-Soo Lee, and Jae Jeong Kim, “The Effect of Inducing Uniform Cu growth on Formation of Electroless Cu Seed Layer”, Thin Solid Films 564 (2014) 299-305.

 

25. Jongwoo Park, Insoo Choi, Ming Jeong Lee, Myeong Ho Kim, Taeho Lim, Kern H. Park, Jihyun jang, Seung M. Oh, Sung Ki Cho, and Jae Jeong Kim, “Effect of fluoroethylene carbonate on electrochemical battery performance and the surface chemistry of amorphous MoO2 lithium-ion secondary battery negative electrodes”, Electrochim. Acta 132 (2014) 338-346.

 

24. Taeho Lim, Kyung Ju Park, Myung Jun Kim, Hyo-Chol Koo, Kwang Hwan Kim, Seunghoe Choe, and Jae Jeong Kim, “Real-Time Observation of Cu Electroless Deposition: Synergetic Suppression Effect of 2,2’-Dipyridyl and 3-N,N-Dimethylaminodithiocarbamoyl-1-propanesulfonic Acid”, J. Electrochem. Soc. 161 (2014) D135-D140.

 

23. Seunghoe Choe, Myung Jun Kim, Hoe Chul Kim, Taeho Lim, Kyung Ju Park, Kwang Hwan Kim, Sang Hyun Ahn, Anna Lee, Soo-Kil Kim, and Jae Jeong Kim, “Degradation of poly(ethylene glycol-propylene glycol) copolymer and its influences on copper electrodeposition”, J. Electroanal. Chem. 714-715 (2014) 85-91.

 

22. Hoe Chul Kim, Myung Jun Kim, Taeho Lim, Kyung Ju Park, Kwang Hwan Kim, Seunghoe Choe, Soo-Kil Kim, and Jae Jeong Kim, “Effects of nitrogen atoms of BTA and its derivatives on the properties of electrodeposited Cu films”, Thin Solid Films 550 (2014) 421-427.

 

2013

 

21. Kwang Hwan Kim, Taeho Lim, Seunghoe Choe, Insoo Choi, Sang Hyun Ahn, Myung Jun Kim, Kyung Ju Park, Min Hyung Lee, Jae Jeong Kim, and Oh Joong Kwon, “Direct Cu Electrodeposition on Ta Using Pd Nanocolloids: Effect of allyl alcohol on the formation of seed layer”, J. Electrochem. Soc. 160 (2013) D3206-D3210.

 

20. Taeho Lim, Kyung Ju Park, Myung Jun Kim, Hyo-Chol Koo, Kwang Hwan Kim, Seunghoe Choe, and Jae Jeong Kim, “Real-Time Observation of Cu Electroless Deposition: Effect of EDTA on Removing of Cu Oxide and Adsorption of Formaldehyde”, J. Electrochem. Soc. 160 (2013) D3134-D3138.

 

19. Myung Jun Kim, Kyung Ju Park, Taeho Lim, Oh Joong Kwon, and Jae Jeong Kim, “Fabrication of Cu-Ag Interconnection Using Electrodeposition: The Mechanism of Superfilling and the Properties of Cu-Ag Film”, J. Electrochem. Soc. 160 (2013) D3126-D3133.

 

18. Myung Jun Kim, Taeho Lim, Kyung Ju Park, Soo-Kil Kim, and Jae Jeong Kim, “Pulse-Reverse Electrodeposition of Cu for the Fabrication of Metal Interconnection II. Enhancement of Cu Superfilling and Leveling”, J. Electrochem. Soc., 160 (2013) D3088-D3092.

 

17. Myung Jun Kim, Taeho Lim, Kyung Ju Park, Soo-Kil Kim, and Jae Jeong Kim, “Pulse-Reverse Electrodeposition of Cu for the Fabrication of Metal Interconnection I. Effects of Anodic Steps on the Competitive Adsorption of the Additives Used for Superfilling”, J. Electrochem. Soc. 160 (2013) D3081-D3087.

 

16. Taeho Lim, Kyung Ju Park, Myung Jun Kim, Hyo-Chol Koo, Kwang Hwan Kim, Seunghoe Choe, Young-Soo Lee, and Jae Jeong Kim, “Real-Time Observation of Cu Electroless Deposition: Adsorption behavior of PEG during Cu Electroless Deposition”, J. Electrochem. Soc. 160 (2013) D3015-D3020.

 

15. Seunghoe Choe, Myung Jun Kim, Heo Chul Kim, Taeho Lim, and Jae Jeong Kim, “Seed Repair by Electrodeposition in Pyrophosphate Solution for Acid Cu Superfilling”, J. Electrochem. Soc. 160 (2013) D202-D205.

 

14. Myung Jun Kim, Kyung Ju Park, Taeho Lim, Seunghoe Choe, Taekyung Yu, and Jae Jeong Kim, “One-Pot Synthesis of PdAu-Au Core-Shell Bimetallic Nanoparticles Using Electrodeposition and Their Optical Property”, J. Electrochem. Soc. 160 (2013) E1-E4.

 

2012

 

13. Myung Jun Kim, Sang Heon Yong, Hyun Seok Ko, Taeho Lim, Kyung Ju Park, Oh Joong Kwon, and Jae Jeong Kim, “Superfilling of Cu-Ag Using Electrodeposition in Cyanide-Based Electrolyte”, J. Electrochem. Soc. 159 (2012) D656-D658.

 

12. Sang Hyun Ahn, Seung Jun Hwang, Sung Jong Yoo, Insoo Choi, Hyoung-Juhn Kim, Jong Hyun Jang, Suk Woo Nam, Tae-Hoon Lim, Taeho Lim, Soo-Kil Kim, and Jae Jeong Kim, “Electrodeposited Ni Dendrites with High Activity and Durability for Hydrogen Evolution Reaction in Alkaline Water Electrolysis”, J. Mater. Chem. 22 (2012) 15153-15159.

 

11. Sang Hyun Ahn, Insoo Choi, Oh Joong Kwon, Taeho Lim, and Jae Jeong Kim, “Electrochemical Preparation of Pt-based Catalysts on Carbon Paper Treated with Sn sensitization and Pd activation”, Int. J. Hydrogen Energ. 37 (2012) 41-50.

 

10. Kyung Ju Park, Myung Jun Kim, Taeho Lim, Hyo-Chol Koo, and Jae Jeong Kim, “Conformal Cu Seed Layer Formation by Electroless Deposition in Non-Bosch through Silicon Vias”, Electrochem. Solid-State Lett. 15 (2012) D26-D28. 

 

9. Myung Jun Kim, Taeho Lim, Kyung Ju Park, Oh Joong Kwon, Soo-Kil Kim, and Jae Jeong Kim, “Characteristics of Pulse-Reverse Electrodeposited Cu Thin Film II. Effects of Organic Additives”, J. Electrochem. Soc. 159 (2012) D544-D548.

 

8. Myung Jun Kim, Taeho Lim, Kyung Ju Park, Sung Ki Cho, Soo-Kil Kim, and Jae Jeong Kim, “Characteristics of Pulse-Reverse Electrodeposited Cu Thin Films I. Effects of the Anodic Step in the Absence of an Organic Additive”, J. Electrochem. Soc. 159 (2012) D538-D543.

 

7. Taeho Lim, Kyung Ju Park, Myung Jun Kim, Hyo-Chol Koo, and Jae Jeong Kim, “Real-Time Observation of Cu Electroless Deposition Using OCP Measurement Assisted by QCM”, J. Electrochem. Soc. 159 (2012) D724-D729.

 

6. Taeho Lim, Hyo-Chol Koo, Kyung Ju Park, Myung Jun Kim, Soo-Kil Kim, and Jae Jeong Kim, “Optimization of Catalyzing Process on Ta Substrate for Copper Electroless Deposition Using Electrochemical Method”, J. Electrochem. Soc. 159 (2012) D142-D147.

 

2011

 

5. Kyung Ju Park, Hyo-Chol Koo, Taeho Lim, Myung Jun Kim, Oh Joong Kwon, and Jae Jeong Kim, “Evaluation of Stability and Reactivity of Cu Electroless Deposition Solution by In-Situ Transmittance Measurement”, J. Electrochem. Soc. 158 (2011) D541-D545.

 

4. Sung Ki Cho, Myung Jun Kim, Taeho Lim, Oh Joong, Kwon, and Jae Jeong Kim, “Deposit profiles characterized by the seed layer in Cu pulse-reverse plating on a patterned substrate”, J. Vac. Sci. Tech. B 29 (2011) 011004-1-011004-5.

 

3. Taeho Lim, Hyo-Chol Koo, Kwang Hwan Kim, Kyung Ju Park, Myung Jun Kim, Oh Joong Kwon, and Jae Jeong Kim, “Room-Temperature Electroless Deposition of CoB Film and its Application as In Situ Capping During Buffing Process”, Electrochem. Solid-State Lett. 14 (2011) D95-D98.

 

2010

 

2. Myung Jun Kim, Sung Ki Cho, Hyo-Chol Koo, Taeho Lim, Kyung Ju Park, and Jae Jeong Kim, “Pulse Electrodeposition for Improving Electrical Properties of Cu Thin Film”, J. Electrochem. Soc. 157 (2010) D564-D569.

 

1. Sung Ki Cho, Taeho Lim, Hong-Kee Lee, and Jae Jeong Kim, “A Study on Seed Damage in Plating Electrolyte and Its Repairing in Cu Damascene Metallization”, J. Electrochem. Soc. 157 (2010) D187-D192.

Patents

2016

6. Oh Joong Kwon, Taeho Lim, “Preparation Method of Onion-Structured Bimetallic Catalyst”, Application number 10-2016-0179715, Republic of Korea. (Applied: 2016.12.27)

5. Oh Joong Kwon, Hyunjoon Lee, Taeho Lim, “Synthesis Method of Metal-Polyaniline Composite”, Application number 10-2016-0013566, Republic of Korea. (Applied: 2016.02.03) 

2014

4. Oh Joong Kwon, Insoo Choi, Taeho Lim, Kwang Hwan Kim, “Metal Seed Layer Leveler Comprising Allyl Alcohol and Method for Constructing Metal Seed Layer Using the Same”, Registration number 1014648600000, Republic of Korea.

2012

3. Jae Jeong Kim, Myung-Won Suh, Young Ho Yoon, Jun Ha Hwang, Young Im, Hyo-Chol Koo, Taeho Lim, “Capping Composition for Post Cu CMP”, Registration number 1012001370000, Republic of Korea.

2. Oh Joong Kwon, Insoo Choi, Taeho Lim, Kwang Hwan Kim, “Semiconductor Device and Method for Forming Metal Thin Film”, Registration number 1011821550000, Republic of Korea.

1. Jae Jeong Kim, Myung-Won Suh, Young Ho Yoon, Jun Ha Hwang, Young Im, Hyo-Chol Koo, Taeho Lim, “Capping Composition for Post Cu CMP”, Registration number 1011050880000, Republic of Korea.

 

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